Defence NSN Source is a one-stop shop for Microcircuit Memory components and other similar products that meet the needs of our customer base. You have taken a specific interest in part number WS57C49C-70CMB, a Waferscale Integration Inc offering we carry that is listed alongside the NSN 5962-01-287-0712 to streamline identification and procurement. If you fill out and submit the Request for Quote (RFQ) form located below, you can secure pricing options for your comparisons. Within 15 minutes of one of our team members receiving and reviewing your submission, you can anticipate a customized response.
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We strive to make the procurement process more straightforward and efficient by offering comprehensive details for listed components whenever possible. For instance, part number WS57C49C-70CMB was manufactured by Waferscale Integration Inc under the CAGECode 66579. Moreover, by using the first digits of the NSN 5962-01-287-0712, we can see that this product belongs to FSC 5962 Microcircuits Electronic. Utilizing such information, you can ensure that you are securing precisely what you need to carry out operations or meet your project requirements. Keeping this in mind, obtain a quote on part number WS57C49C-70CMB with our online services.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-287-0712 Item Description: Microcircuit Memory | 5962 | 012870712 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| WS57C49C-70CMB | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND HIGH SPEED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-4 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.6 VOLTS MINIMUM POWER SOURCE AND 14.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
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