Defence NSN Source is a one-stop shop for Transistor components and other similar products that meet the needs of our customer base. You have taken a specific interest in part number SD10158-2, a Solitron Devices Inc offering we carry that is listed alongside the NSN 5961-01-395-0026 to streamline identification and procurement. If you fill out and submit the Request for Quote (RFQ) form located below, you can secure pricing options for your comparisons. Within 15 minutes of one of our team members receiving and reviewing your submission, you can anticipate a customized response.
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We strive to make the procurement process more straightforward and efficient by offering comprehensive details for listed components whenever possible. For instance, part number SD10158-2 was manufactured by Solitron Devices Inc under the CAGECode 21845. Moreover, by using the first digits of the NSN 5961-01-395-0026, we can see that this product belongs to FSC 5961 Semiconductor Devices and Associated Hardware. Utilizing such information, you can ensure that you are securing precisely what you need to carry out operations or meet your project requirements. Keeping this in mind, obtain a quote on part number SD10158-2 with our online services.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-395-0026 Item PartTypeName: TRANSISTOR | 5961 | 013950026 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
SD10158-2 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
TEST | TEST DATA DOCUMENT | 80063-A3110509 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
TTQY | TERMINAL TYPE AND QUANTITY | 3 PIN |
ABHP | OVERALL LENGTH | 0.933 INCHES NOMINAL |
AKPV | MOUNTING FACILITY QUANTITY | 1 |
ALAS | INTERNAL CONFIGURATION | FIELD EFFECT |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
FEAT | SPECIAL FEATURES | CONTAINS BERYLLIUM OXIDE. HANDLE AND DISPOSE IAW HAZMAT PROCEDURES. |
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABKW | OVERALL HEIGHT | 0.375 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.415 INCHES NOMINAL |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-257 |
AXGY | MOUNTING METHOD | UNTHREADED HOLE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 500.0 MAXIMUM DRAIN TO SOURCE VOLTAGE AND 16.0 MAXIMUM GATE TO SOURCE VOLTAGE |
CTQX | CURRENT RATING PER CHARACTERISTIC | 4.50 AMPERES MAXIMUM DRAIN CURRENT |
CTRD | POWER RATING PER CHARACTERISTIC | 50.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
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